HI-LO Systems AT3-310A6

High Performance Automated Programming System

• Up to 3000↑ UPH with 4 nozzles
• Equipped with 4-6 units programmer, 64 devices can be programmed simultaneously
• Handles 1mm x 1mm – 40mm x 40 mm devices.
• 2D/3D vision inspection on IC leads/balls/pad to prevent any defect.
• Minimize the jam rate as well as the possibility of lead bent during handling
• Capable of handling as small as 1mm x 1mm devices such as WLCSP
• Device supported: UFS, eMMC, eMCP, MCU/MPU, NOR/NAND Flash EEPROM, SPI Memory, FPGA, CPLD, etc.
• Package supported: DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, WLCSP, etc.
• Arm camera (1.3M pixels) for socket positioning
• Fixed camera (3M pixels) for IC pick & place positioning
• Optional AOI for 2D/3D inspection of IC appearance
• Laser displacement sensor: Automated height calibration of picking IC (Z-axis)
• Automated IC pick & place positioning reduces the changeover time to 15 minutes or less
• Support package conversion between tape, tray, and tube
• One-Click Start: Operators can start production simply by scanning the barcode, significantly eliminating human errors
• E-Board: Visualize and update production statistics (Yield rate, UPH, the condition of sockets, etc.) promptly for management to track anytime
• Program Track System(PTS): Completely record every order from end to end throughout the production process and provide valid statistics for management, realizing statistical process control (SPC)